JPH0348675B2 - - Google Patents

Info

Publication number

JPH0348675B2

JPH0348675B2 JP4836982A JP4836982A JPH0348675B2 JP H0348675 B2 JPH0348675 B2 JP H0348675B2 JP 4836982 A JP4836982 A JP 4836982A JP 4836982 A JP4836982 A JP 4836982A JP H0348675 B2 JPH0348675 B2 JP H0348675B2

Authority

JP

Japan

Prior art keywords

film

substrate

adhesive

prepreg

adhesive layer

Prior art date

1982-03-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000000758 substrate Substances 0.000 claims description 60
• 239000000853 adhesive Substances 0.000 claims description 41
• 230000001070 adhesive effect Effects 0.000 claims description 41
• 239000011248 coating agent Substances 0.000 claims description 16
• 238000000576 coating method Methods 0.000 claims description 16
• 238000000034 method Methods 0.000 claims description 12
• 239000012790 adhesive layer Substances 0.000 claims description 11
• 238000001035 drying Methods 0.000 claims description 10
• 238000007772 electroless plating Methods 0.000 claims description 10
• 238000004519 manufacturing process Methods 0.000 claims description 8
• 239000000463 material Substances 0.000 claims description 4
• 229920003002 synthetic resin Polymers 0.000 claims description 4
• 239000000057 synthetic resin Substances 0.000 claims description 4
• 239000002966 varnish Substances 0.000 claims description 3
• -1 polypropylene Polymers 0.000 description 11
• 239000004743 Polypropylene Substances 0.000 description 9
• 229920001155 polypropylene Polymers 0.000 description 9
• 238000009824 pressure lamination Methods 0.000 description 9
• 238000010030 laminating Methods 0.000 description 8
• BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 6
• 239000002985 plastic film Substances 0.000 description 5
• 229920006255 plastic film Polymers 0.000 description 5
• 229920002284 Cellulose triacetate Polymers 0.000 description 4
• NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 4
• 239000003960 organic solvent Substances 0.000 description 4
• 238000004804 winding Methods 0.000 description 4
• ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
• YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
• 229920002301 cellulose acetate Polymers 0.000 description 3
• 238000007747 plating Methods 0.000 description 3
• 239000002904 solvent Substances 0.000 description 3
• 230000037303 wrinkles Effects 0.000 description 3
• 238000007796 conventional method Methods 0.000 description 2
• 238000003475 lamination Methods 0.000 description 2
• 239000000155 melt Substances 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 239000006082 mold release agent Substances 0.000 description 2
• 239000005011 phenolic resin Substances 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229920001187 thermosetting polymer Polymers 0.000 description 2
• KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229920000459 Nitrile rubber Polymers 0.000 description 1
• 239000004698 Polyethylene Substances 0.000 description 1
• XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
• 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
• 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
• 230000015572 biosynthetic process Effects 0.000 description 1
• 239000003054 catalyst Substances 0.000 description 1
• 239000003795 chemical substances by application Substances 0.000 description 1
• 238000001816 cooling Methods 0.000 description 1
• 229920001577 copolymer Polymers 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000007797 corrosion Effects 0.000 description 1
• 238000005260 corrosion Methods 0.000 description 1
• 230000008021 deposition Effects 0.000 description 1
• KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 239000005038 ethylene vinyl acetate Substances 0.000 description 1
• 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
• 238000001704 evaporation Methods 0.000 description 1
• XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
• 239000011888 foil Substances 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 239000010410 layer Substances 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 229920001568 phenolic resin Polymers 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 229920000728 polyester Polymers 0.000 description 1
• 229920006267 polyester film Polymers 0.000 description 1
• 229920000573 polyethylene Polymers 0.000 description 1
• 229920000306 polymethylpentene Polymers 0.000 description 1
• 239000011116 polymethylpentene Substances 0.000 description 1
• 230000007261 regionalization Effects 0.000 description 1
• 238000010019 resist printing Methods 0.000 description 1
• 238000007788 roughening Methods 0.000 description 1
• 238000007665 sagging Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 239000007787 solid Substances 0.000 description 1
• 238000001179 sorption measurement Methods 0.000 description 1
• 239000000126 substance Substances 0.000 description 1
• 230000008719 thickening Effects 0.000 description 1
• 239000011787 zinc oxide Substances 0.000 description 1
• 235000014692 zinc oxide Nutrition 0.000 description 1